X-ray inspection of printed circuit boards

Our production assists in carrying out X-ray inspection of printed circuit boards, components and assemblies.
HIGH-RAY INSPECTION SYSTEM FOR PRINTED CIRCUIT BOARD VISCOM H8011
H8011 - a powerful and high-performance X-ray inspection of printed circuit boards, components and assemblies. The system can operate in manual, semi-automatic and automatic modes.
H8011 is used to control solder joints BGA, CSP, FLIP CHIP components, as well as to control the deformation pins QFP components pads and wire connections inside the hull and chip components. Inspection takes place in real time, and X-ray image is displayed on the monitor of a desktop computer. High quality inspections provided by solid metal microfocus X-ray tube with a focus less than 1 micron and an increase in object 1250 times.